Photonic Integrated Circuits for Sensing Applications: A Review of Packaging as the Cost Driver

Authors

  • Leevi Jauhiainen Centre for Applied Photonics, Ita-Uusimaa Centre for Emerging Materials, Porvoo, Finland Author
  • Jodok Angerbauer Centre for Microfabrication, Montafon Institute of Advanced Technology, Schruns, Austria Author
  • Iarla Arrigan Department of Manufacturing Engineering, Barrow Valley Centre for Emerging Materials, Athy, Ireland Author

DOI:

https://doi.org/10.5281/zenodo.22673955

Keywords:

Photonic Integrated Circuits for Sensing Applications; Next-generation R&D; Evidence synthesis; Reproducibility; Research methodology

Abstract

There is real interest in photonic integrated circuits for sensing applications right now, and real uncertainty about exactly where it
delivers the most value. We pull together the current evidence for photonic integrated circuits for sensing applications, covering
the methodological, practical, regulatory and cost angles, with an eye on where practice has genuinely settled and where
engineers and reviewers are still largely working it out for themselves. Selective, context-specific adoption looks better supported
by the evidence gathered here than either broad rollout or blanket avoidance.

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Published

2025-09-25

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Vol. 4 No. 2 (2025): vol 4 issue 2 2025

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